Mounting of laser bars on copper heat sinks using Au/Sn solder and CuW submounts-Reference-Cited by-同舟云学术

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Mounting of laser bars on copper heat sinks using Au/Sn solder and CuW submounts

Published: Issue: Volume: Page:
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Container-title:52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
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Author:

Pittroff W.,Erbert G.,Klein A.,Staske R.,Sumpf B.,Traenkle G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7890/21740/01008107.pdf?arnumber=1008107

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Degree of Polarization of Cathodoluminescence from a (100) GaAs Substrate with SiN Stripes;Optics;2024-01-17

2. Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250 °C;Materials Science and Engineering: A;2016-01

3. High-Power, High-Efficiency Monolithic Edge-Emitting GaAs-Based Lasers with Narrow Spectral Widths;Advances in Semiconductor Lasers;2012

4. Powerful semiconductor laser bars on 950 nm for pulse energy greater 200MJ;2008 9th International Conference on Actual Problems of Electronic Instrument Engineering;2008-09

5. Influence of Bonding Temperature and Applied Load on the Bonding Integrity and Optical Performance of Face-Down Bonded Ridge-Waveguide Lasers;Journal of Electronic Materials;2007-09-19

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