Novel packaging with rematable spring interconnect chips for MCM-Reference-Cited by-同舟云学术

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Novel packaging with rematable spring interconnect chips for MCM

Published:2009-05 Issue: Volume: Page:
ISSN:
Container-title:2009 59th Electronic Components and Technology Conference
language:
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Author:

Shubin I.,Chow E.M.,Cunningham J.,De Bruyker D.,Chua C.,Cheng B.,Knights J.C.,Sahasrabuddhe K.,Luo Y.,Chow A.,Simons J.,Krishnamoorthy A.V.,Hopkins R.,Drost R.,Ho R.,Douglas D.,Mitchell J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5066986/5073977/05074142.pdf?arnumber=5074142

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

2. Opportunities and Challenges of Pressure Contact Packaging for Wide Bandgap Power Modules;IEEE Transactions on Power Electronics;2024-02

3. Post-CMOS Fabrication Technology Enabling Simultaneous Fabrication of 3-D Solenoidal Micro-Inductors and Flexible I/Os;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-11

4. Flexible Interconnect Design Using a Mechanically-Focused, Multi-Objective Genetic Algorithm;Journal of Microelectromechanical Systems;2018-08

5. Reliability of spring interconnects for high channel-count polyimide electrode arrays;Journal of Micromechanics and Microengineering;2018-03-08

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