System-on-Package (SOP) Technology, Characterization and Applications-Reference-Cited by-同舟云学术

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System-on-Package (SOP) Technology, Characterization and Applications

Published: Issue: Volume: Page:
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Container-title:56th Electronic Components and Technology Conference 2006
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Author:

Knickerbocker J.U.,Andry P.S.,Buchwalter L.P.,Colgan E.G.,Cotte J.,Gan H.,Horton R.R.,Sri-Jayantha S.M.,Magerlein J.H.,Manzer D.,McVicker G.,Patel C.S.,Polastre R.J.,Sprogis E.S.,Tsang C.K.,Webb B.C.,Wright S.L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10951/34490/01645680.pdf?arnumber=1645680

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heterogeneous Integrated Microsystems With Nontraditional Through-Silicon Via Technologies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-04

2. A Study on Through-Silicon-via Using Tri-Block Copolymer and Pulse Electroplating;Journal of Nanoscience and Nanotechnology;2016-08-01

3. Through-Silicon Vias: Drivers, Performance, and Innovations;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-07

4. Effects of Creep Parameters of Lead-Free Solders on Fatigue Reliability of 3D IC Packages with through Silicon Vias;Applied Mechanics and Materials;2013-08

5. Novel photodefined polymer-embedded vias for silicon interposers;Journal of Micromechanics and Microengineering;2013-01-24

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