Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration-Reference-Cited by-同舟云学术

Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration

Published:2023 Issue: Volume: Page:1-11
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Tang Wei¹^ORCID,Cho Sung-Gun²^ORCID,Hoang Tim Tri²,Botimer Jacob³^ORCID,Zhu Wei Qiang²^ORCID,Chang Ching-Chi²,Lu Cheng-Hsun¹^ORCID,Zhu Junkang¹^ORCID,Tao Yaoyu¹^ORCID,Wei Tianyu¹,Motwani Naomi Kavi¹,Yalamanchi Mani²,Yarlagadda Ramya²,Kale Sirisha Rani²,Flanigan Mark²,Chan Allen²^ORCID,Tran Thungoc²,Shumarayev Sergey²,Zhang Zhengya¹^ORCID

Affiliation:

1. Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA

2. Intel Corporation, Santa Clara, CA, USA

3. Memryx, Ann Arbor, MI, USA

Funder

Defense Advanced Research Projects Agency (DARPA) Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) Program, The Office of Naval Research

ACE Center for Evolvable Computing and the Center for Ubiquitous Connectivity (CUbiC), sponsored by Semiconductor Research Corporation (SRC) and DARPA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/4/4359912/10374406.pdf?arnumber=10374406

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