Efficient RF-PA Two-Chip Supply Modulator Architecture for 4G LTE and 5G NR Dual-Connectivity RF Front End-Reference-Cited by-同舟云学术

Efficient RF-PA Two-Chip Supply Modulator Architecture for 4G LTE and 5G NR Dual-Connectivity RF Front End

Published:2022-04 Issue:4 Volume:57 Page:1075-1089
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Paek Ji-Seon¹^ORCID,Kim Dongsu¹^ORCID,Han Jae-Yeol¹,Choo Younghwan¹,Bang Jun-Suk¹,Park Seungchan¹,Baek Jongbeom¹,Nomiyama Takahiro¹,Kim Ik-Hwan¹,Lee Jongwoo¹

Affiliation:

1. System LSI Business, Samsung Electronics, Hwaseong, South Korea

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/4/9741814/09705508.pdf?arnumber=9705508

Reference29 articles.

1. An 87.1% efficiency RF-PA envelope-tracking modulator for 80MHz LTE-Advanced transmitter and 31dBm PA output power for HPUE in 0.153μm CMOS

2. 15.1 an 88%-efficiency supply modulator achieving $1.08~\mu\text{s}$ /V fast transition and 100MHz envelope-tracking bandwidth for 5G new radio RF power amplifier;paek;IEEE ISSCC Dig Tech Papers,2019

3. 33.9 A Hybrid Switching Supply Modulator Achieving 130MHz Envelope-Tracking Bandwidth and 10W Output Power for 2G/3G/LTE/NR RF Power Amplifiers

4. A 2TX supply modulator for envelope-tracking power amplifier supporting intra- and inter-band uplink carrier aggregation and power class-2 high-power user equipment

5. Efficient RF-PA Two-Chip Supply Modulator Architecture for 4G LTE and 5G NR Dual-Connectivity RF Front-End

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