Solid-State dToF LiDAR System Using an Eight-Channel Addressable, 20-W/Ch Transmitter, and a 128 × 128 SPAD Receiver With SNR-Based Pixel Binning and Resolution Upscaling-Reference-Cited by-同舟云学术

Solid-State dToF LiDAR System Using an Eight-Channel Addressable, 20-W/Ch Transmitter, and a 128 × 128 SPAD Receiver With SNR-Based Pixel Binning and Resolution Upscaling

Published:2023-03 Issue:3 Volume:58 Page:757-770
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Zhuo Shenglong¹^ORCID,Xia Tao¹^ORCID,Zhao Lei¹,Sun Miao¹^ORCID,Wu Yifan²,Wang Lei³,Yu Hengwei¹^ORCID,Xu Jiqing¹,Wang Jier¹,Lin Zhihong¹,Li Yuan¹,Qiu Lei²^ORCID,Bai Rui³,Chen Xuefeng³,Chiang Patrick Yin¹

Affiliation:

1. State Key Laboratory of Application-Specific Integrated Circuit (ASIC) and System, School of Microelectronics, Fudan University, Shanghai, China

2. College of Electronics and Information Engineering, Tongji University, Shanghai, China

3. PhotonIC Technologies Inc., Shanghai, China

Funder

Shanghai 2020 “Science and Technology Innovation Action Plan”

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/4/10051119/09991882.pdf?arnumber=9991882

Reference46 articles.

1. A Reconfigurable 3-D-Stacked SPAD Imager With In-Pixel Histogramming for Flash LIDAR or High-Speed Time-of-Flight Imaging

2. An 8A sub-1ns pulsed VCSEL driver IC with built-in pulse monitor and automatic peak current control for direct time-of-flight applications;xia;IEEE Trans Circuits Syst II Exp Briefs,2022

3. A 256×256 45/65 nm 3D-stacked SPAD-based direct TOF image sensor for LiDAR applications with optical polar modulation for up to 18.6dB interference suppression;ximenes;IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers,2018

4. An integrated 8A pulsed VCSEL array driver under 12V supply with built-in pulse monitor and automatic peak current control for direct time-of-flight applications

5. 7.3 A 189×600 back-illuminated stacked SPAD direct time-of-flight depth sensor for automotive LiDAR systems;kumagai;IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers,2021

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