Particulate contamination control in plasma processing: building-in reliability for semiconductor fabrication
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx2/3546/10637/00493585.pdf?arnumber=493585
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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3. Modification of discharge sequences to control the random dispersion of flake particles during wafer etching;Journal of Vacuum Science & Technology B;2023-11-14
4. Charging of Irregularly-Shaped Dust Grains near Surfaces in Space;AIAA SCITECH 2023 Forum;2023-01-19
5. Plasma deposited high surface area‐activated carbon coatings: Theory combining particle generation, aggregation and deposition explains microstructure;Plasma Processes and Polymers;2022-04-15
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