The Study on Warpage of Epoxy Molding Compound-Reference-Cited by-同舟云学术

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The Study on Warpage of Epoxy Molding Compound

Published:2022-06-20 Issue: Volume: Page:
ISSN:
Container-title:2022 China Semiconductor Technology International Conference (CSTIC)
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Author:

Duan Yangyang¹,Tan Wei¹,Liu Hongjie¹,Li Lanxia¹,Fan Dandan¹,Liu Lingling¹,Cheng Xingming¹

Affiliation:

1. Jiangsu Hua Hai Cheng Ke Advanced Material Co. Ltd.,Lianyungang,China,222047

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856765.pdf?arnumber=9856765

Reference5 articles.

1. Requirements and solutions of epoxy molding compound for high-end packaging;tan;Equipment for Electronic Products Manufacturing,2015

2. Investigation on Block Warpage of FBGA Package;yu;Equipment for Electronic Products Manufacturing,2014

3. Warpage analysis of FBGA packaging during assembling process;liu;Electronic Components & materials,2014

4. Flat bump package;liang;Electronics&Packing,2006

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Effect of Epoxy Molding Compound Dispensing Uniformity on PoP Warpage;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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