Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
4 articles.
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1. Effective congestion reduction for IC package substrate routing;ACM Transactions on Design Automation of Electronic Systems;2010-05
2. Substrate Topological Routing for High-Density Packages;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2009-02
3. On crossing minimization problem;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;1998-05
4. A faster one-dimensional topological compaction algorithm;Algorithms and Computation;1997