EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module-Reference-Cited by-同舟云学术

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EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module

Published:2022-10-09 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Energy Conversion Congress and Exposition (ECCE)
language:
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Author:

Li Xiaoling¹,Chen Yuxiang¹,Chen Hao¹,Chinnaiyan Sudharsan¹,Li Tianchen²,Cuzner Robert²,Nasiri Adel³,Mantooth Alan¹,Zhao Yue¹

Affiliation:

1. University of Arkansas,Department of Electrical Engineering,Fayetteville,AR,USA

2. College of Engineering and Applied Science University of Wisconsin-Milwaukee,Milwaukee,WI,USA

3. College of Engineering and Computing, University of South Carolina,Columbia,SC,USA

Funder

National Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9947299/9947300/09947391.pdf?arnumber=9947391

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improved Packaging of Power Module With Low-Permittivity Material for Low Common-Mode Noise and High Reliability;IEEE Transactions on Power Electronics;2024-11

2. Performance and Characterization of Optimal Harmonic Dispersion Effect in Double Frequency-Band Random PWM Strategy;IEEE Transactions on Power Electronics;2024-11

3. A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution;IEEE Transactions on Power Electronics;2024-08

4. A Review of Partial Discharge in Medium Voltage SiC Power Modules Under Square Wave Excitation: Characterization, Mitigation, and Detection;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08

5. A Review of Radiated EMI Research in Power Electronics Systems;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-02

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