Thermal Model for Heat Conduction in Octagonal Integrated Inductor Multilayer
Author:
Affiliation:
1. University of Science and Technology,Department of Electrical Engineering,Oran,Algeria
2. National Institute Telecommunication,Oran,Algeria
3. Center university of Science and Technology,Department of Electrical Engineering,E1 Bayadh,Algeria
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9955493/9955494/09955661.pdf?arnumber=9955661
Reference12 articles.
1. Thermal Modeling of an Integrated Circular Inductor
2. Influence of Power Losses in the Inductor Core on Characteristics of Selected DC–DC Converters
3. Modeling and simulation of an integrated octagonal planar transformer for RF systems
4. Developments for the High Frequency Power Transformer Design and Implementation;sippola;Disser-tation for the Degree of Doctor of Science in Technology,2003
5. Design and Implementation of Inductors with Variable Conductor Width Integrated in a Boost Micro Converter;kharbouch;Transactions on Electrical and Electronic Materials,2020
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