An Approach to Bridge ROS 1 and ROS 2 Devices into an OPC UA-based Testbed for Industry 4.0
Author:
Affiliation:
1. Université Paris-Saclay, CEA,Palaiseau,France,F-91120
2. LTCI, Telecom Paris, Institut Polytechnique de Paris,Palaiseau,France,F-91120
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10126133/10126141/10126783.pdf?arnumber=10126783
Reference15 articles.
1. Assembly Line Planning and Control
2. OPC UA/DDS Gateway;Object Management Group,2020
3. An OPC UA PubSub Implementation Approach for Memory-Constrained Sensor Devices
4. From Requirement Specification to OPC UA Information Model Design: A Product Assembly Line Monitoring Case Study
5. DDS and OPC UA Protocol Coexistence Solution in Real-Time and Industry 4.0 Context Using Non-Ideal Infrastructure
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