Data Compression for Ultrasonic Microstructure Scattering Signals using Unsupervised Neural Networks
Author:
Affiliation:
1. Illinois Institute of Technology,Embedded Computing and Signal Processing (ECASP) Research Laboratory,Department of Electrical and Computer Engineering,Chicago,Illinois,U.S.A.
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10306337/10306342/10308084.pdf?arnumber=10308084
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