Acoustic Devices (PAW, SAW, and BAW) using Wafer Bonding Technology
Author:
Affiliation:
1. Tohoku University,Graduate School of Engineering,Department of Robotics,Sendai,Japan
Funder
Ministry of Internal Affairs and Communications
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10306337/10306342/10306999.pdf?arnumber=10306999
Reference42 articles.
1. Small Surface Acoustic Wave Duplexer for Wide-Band Code-Division Multiple Access Full-Band System Having Good Temperature Characteristics
2. 3.4 GHz strip-type thickness shear mode solidly-mounted bulk acoustic wave resonator using X-cut LiTaO3
3. Smaller Surface Acoustic Wave Duplexer for US Personal Communication Service Having Good Temperature Characteristics
4. High Frequency Strip-Type Solidly-Mounted Shear Mode Bulk Wave Resonator Using X-LT
5. A hybrid substrate for a temperature-compensated surface acoustic wave filter
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2. 9.5–12 GHz solidly mounted bulk acoustic wave resonators utilizing overtone of thickness extension mode;Japanese Journal of Applied Physics;2024-03-01
3. Epitaxial ZnO piezoelectric layer on SiO2/Mo solidly mounted resonator fabricated using epitaxial Au sacrificial layer;Applied Physics Express;2024-02-01
4. Serially connected strip-type acoustic wave resonator using X-40°Y LiNbO3 (XSAR)—feasibility study using macro model;Japanese Journal of Applied Physics;2024-01-09
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