1. Study on Signal Optimization of PCB Design for Wireless Communication;2024 IEEE 2nd International Conference on Control, Electronics and Computer Technology (ICCECT);2024-04-26
2. Evaluating 224G SI Performance of Vertical Interconnections on Package Substrate and PCB;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
3. A New Method for Power-Aware Signal Integrity Analysis with Spice Model of Power Distribution Network;2022 IEEE 22nd International Conference on Communication Technology (ICCT);2022-11-11
4. Research on the Influence of Solder Mask on Signal Integrity in High Speed PCB;2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI);2021-10-29