Chamber matching across multiple dimensions utilizing Predictive Maintenance, Equipment Health Monitoring, Virtual Metrology and Run-To-Run control
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/6843030/6846940/06846983.pdf?arnumber=6846983
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Cyber-Physical Systems Framework for Predictive Metrology in Semiconductor Manufacturing Process;International Journal of Precision Engineering and Manufacturing-Smart Technology;2023-01-01
2. Factory Integration;2021 IEEE International Roadmap for Devices and Systems Outbriefs;2021-11
3. Virtual metrology as an approach for product quality estimation in Industry 4.0: a systematic review and integrative conceptual framework;International Journal of Production Research;2021-09-21
4. Chamber-to-Chamber Discrepancy Detection in Semiconductor Manufacturing;IEEE Transactions on Semiconductor Manufacturing;2020-02
5. A Requirements Driven Digital Twin Framework: Specification and Opportunities;IEEE Access;2020
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