Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate
Author:
Affiliation:
1. Micro Nano Sciences and Systems Department, FEMTO-ST Institute, Besançon, France
2. System Packaging Department, Fraunhofer Institute for Electronic Nanosystems, Chemnitz, Germany
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/68/6679252/06657824.pdf?arnumber=6657824
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