Sensors for automatic process control of wire bonding-Reference-Cited by-同舟云学术

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Sensors for automatic process control of wire bonding

Published: Issue: Volume: Page:
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Container-title:ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics
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Author:

Or S.W.,Chan H.L.W.,Lo V.C.,Yuen C.W.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/4659/13054/00598195.pdf?arnumber=598195

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-05

2. Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network;IEEE Transactions on Semiconductor Manufacturing;2014-05

3. Effect of electrode pattern on the outputs of piezosensors for wire bonding process control;Materials Science and Engineering: B;2003-05

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