Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement-Reference-Cited by-同舟云学术

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Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement

Published:2022-10 Issue:5 Volume:39 Page:34-42
ISSN:2168-2356
Container-title:IEEE Design & Test
language:
Short-container-title:IEEE Des. Test

Author:

Ni Tianming¹^ORCID,Bian Jingchang²^ORCID,Yang Zhao²,Nie Mu¹,Yao Liang²,Huang Zhengfeng²^ORCID,Yan Aibin³^ORCID,Wen Xiaoqing⁴^ORCID

Affiliation:

1. College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China

2. School of Microelectronics, Hefei University of Technology, Hefei, China

3. School of Computer Science and Technology, Anhui University, Hefei, China

4. Department of Creative Informatics, Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan

Funder

the Natural Science Foundation of Anhui Province

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/6221038/9875417/09825654.pdf?arnumber=9825654

Reference13 articles.

1. Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs

2. TSV Redundancy: Architecture and Design Issues in 3-D IC

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC;Microelectronics Reliability;2024-07

2. Built-in Self-prevention (BISP) for runtime ageing effects of TSVs in 3D ICs;Integration;2024-01

3. Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs;Microelectronics Reliability;2023-12

4. Modelling and analysis of contactless sensor for TSV fault based on resonant inductive coupling;Microelectronics Reliability;2023-06

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