Recycling Test Methods to Improve Test Capacity and Increase Chip Shipments
Author:
Affiliation:
1. Department of Electrical Engineering, National Central University, Taoyuan, Taiwan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx7/6221038/10106531/09945994.pdf?arnumber=9945994
Reference12 articles.
1. Reducing the overkills and retests in wafer testing process
2. Intelligent method for retesting a wafer;huang,2022
3. Wafer-Level Die Re-Test Success Prediction Using Machine Learning
4. Repeated Testing Applications for Improving the IC Test Quality to Achieve Zero Defect Product Requirements
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1. Using the Test Guardband Estimation Method to Forecast Future Semiconductor Yield Trends;IETE Journal of Research;2024-02
2. Retesting Schemes That Improve Test Quality and Yield Using a Test Guardband;Eng;2023-12-13
3. Prediction of the Test Yield of Future Integrated Circuits Through the Deductive Estimation Method;Journal of Circuits, Systems and Computers;2023-02-20
4. Multiple Retest Systems for Screening High-Quality Chips;Journal of Electronic Testing;2023-02-20
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