A Global Self-Repair Method for TSV Arrays With Adaptive FNS-CAC Codec
Author:
Affiliation:
1. Peking University Shenzhen Graduate School, Shenzhen, China
2. Institute of Microelectronics, Peking University, Beijing, China
Funder
Shenzhen Science and Technology Innovation Committee
the Key-Area Research and Development Program of Guangdong Province
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx7/6221038/9875417/09796564.pdf?arnumber=9796564
Reference11 articles.
1. An Exhaustive Search of the Optimal 6C Level Static Shielding Scheme for Rectangle TSV Arrays
2. An exhaustive search of the 6C level crosstalk avoidance codes for TSV array
3. On effective TSV repair for 3D-stacked ICs
4. An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias
5. Architecture of Ring-Based Redundant TSV for Clustered Faults
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC;Microelectronics Reliability;2024-07
2. Dy-MFNS-CAC: An Encoding Mechanism to Suppress the Crosstalk and Repair the Hard Faults in Rectangular TSV Arrays;IEEE Transactions on Reliability;2023
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