Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software,Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Chip/Package/Board Co-Design Methodology Applied to Full-Custom Heterogeneous Integration;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
2. The COMSON Project;Mathematics in Industry;2015
3. Wire Optimization for Multimedia SoC and SiP Designs;IEEE Transactions on Circuits and Systems I: Regular Papers;2008-09