Wirebond Stability Resolution on Automotive MEMS Device Through Tape Adhesion Thickness and Plasma Characterization
Author:
Affiliation:
1. STMicroelectronics, Inc.,Calamba City,Laguna,Philippines,4027
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457586.pdf?arnumber=10457586
Reference12 articles.
1. Wirebonding Characterization and Optimization on Thick Filmsu-8 MEMS Structures and Actuators
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3. A Systematic Approach in Optimizing Critical Processes of High Density and High Complexity New Scalable Device in MAT29 Risk Production Using State-of-the-Art Platforms;Sumagpang
4. Wirebond Reliability - an Overview on the Mechanism of Formation/Growth of Intermetallics;Ling;Semicon, Singapore,2008
5. Emerging Business Trends in the Semiconductor Industry;Saha
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