Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity

Author:

Conseil-Gudla HeleneORCID,Li Feng,Ambat Rajan

Funder

CELCORR/CreCon Consortium

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A systematic corrosion failure analysis of Li-ion powered hearing aids from various markets;Corrosion Engineering, Science and Technology: The International Journal of Corrosion Processes and Corrosion Control;2024-09-05

2. Electrochemical Migration Behavior on FR-4 Printed Circuit Board with Different Surface Finishes;Journal of Electronic Materials;2023-06-30

3. Process Optimization Using Value Stream Mapping in PCB Manufacturing;2022 International Conference on Trends in Quantum Computing and Emerging Business Technologies (TQCEBT);2022-10-13

4. Effect of alloy particle size and stencil aperture shape on solder printing quality;Microelectronics International;2022-05-05

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