Effect of Large Amplitude Thermal Cycles on Power Assemblies Based on Ceramic Heat Sink and Multilayer Pressureless Silver Sintering
Author:
Affiliation:
1. University of Grenoble Alpes, CNRS, Grenoble INP, G2Elab/SIMAP, Grenoble, France
2. Electrical and Electronic Systems Research Department, Safran Tech, Magny-Les-Hameaux, France
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/7298/10145596/10049151.pdf?arnumber=10049151
Reference20 articles.
1. Power Module Using Ceramic Heat Sink and Multilayers Silver Sintering
2. Reliability of thermal interface materials: A review
3. Study of the assembly of a SiC power module on ceramic heatsink with double-sided cooling system;botter,2022
4. Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering
5. On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters
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1. Comprehensive Influences of Manufacturing Process Integrated with Thermal Cycling Test Loading on Mechanical Responses of Power Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023
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