Multiple Phase Change Materials Integrated Into Power Module for Normal and High Current Reliability Enhancement
Author:
Affiliation:
1. School of Electrical Engineering, Chongqing University, Chongqing, China
2. Research and Development Center, Chaoyang Microelectronics Technology Ltd., Chaoyang, China
3. School of Engineering, University of Warwick, Coventry, U.K
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/7298/10063987/10015792.pdf?arnumber=10015792
Reference20 articles.
1. A Physics-Based Improved Cauer-Type Thermal Equivalent Circuit for IGBT Modules
2. Reliability Enhancement of Power Modules by Restricting Junction Temperature Fluctuation through Increased Transient Thermal Capacity
3. Computational analysis of the melting process of Phase change material-metal foam-based latent thermal energy storage unit: The heat exchanger configuration
4. Phase change materials for vehicle and electronic transient thermal systems;jankowski,2020
5. Effects of the heat transfer fluid velocity on the storage characteristics of a cylindrical latent heat energy storage system: a numerical study
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