Evaluation of Doubled-sided Substrate Attachment Technique for Round Shaped Large Metallic Housing under Airborne System Development-Reference-Cited by-同舟云学术

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Evaluation of Doubled-sided Substrate Attachment Technique for Round Shaped Large Metallic Housing under Airborne System Development

Published:2020-10-30 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 5th International Conference on Computing Communication and Automation (ICCCA)
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Author:

Sarkar Mahadev,Raghu B. R.,Sudheesh K. S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9250743/9250710/09250792.pdf?arnumber=9250792

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultra Wideband Reflective SP4T Switch Using MMIC Discrete Components’ Topology;2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON);2023-12-11

2. Phase Non-Linearity Estimation and Reduction of IFM Receiver;2023 International Conference on Microwave, Optical, and Communication Engineering (ICMOCE);2023-05-26

3. Sharp Rejection Low Loss Ultra Wideband Pseudo High Pass Filter;2022 International Conference for Advancement in Technology (ICONAT);2022-01-21

4. Improved Complex Receiver System Design Strategies to Overcome EMI/EMC Challenges;IEEE Electromagnetic Compatibility Magazine;2022

5. Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors;Applied Sciences;2021-02-16

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