New receptacle optical modules using ferrule-integrated chip carrier with solder-bump-bonded photonic device: Singlemode-fiber-based high-speed PIN PD receivers-Reference-Cited by-同舟云学术

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New receptacle optical modules using ferrule-integrated chip carrier with solder-bump-bonded photonic device: Singlemode-fiber-based high-speed PIN PD receivers

Published:1998-12 Issue:4 Volume:21 Page:592-598
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Hayashi Tsuyoshi,Tsunetsugu Hideki

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/15985/00740052.pdf?arnumber=740052

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Carbon Fiber-Based Grid Array Interconnects;IEEE Transactions on Components and Packaging Technologies;2007-12

2. Properties of ZrO₂/Glass-Ceramics Composite;Key Engineering Materials;2007-02

3. A Statistical Mechanical Model of Electrical Carbon Fiber Contacts;Journal of Electronic Packaging;1999-12-01

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