The Challenges and Opportunities of Transitioning to Modular Smartphones-Reference-Cited by-同舟云学术

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The Challenges and Opportunities of Transitioning to Modular Smartphones

Published:2024-04-14 Issue: Volume:5 Page:196-203
ISSN:
Container-title:2024 IEEE Conference on Technologies for Sustainability (SusTech)
language:
Short-container-title:

Author:

Lomax Kevin¹,Donker Jaap²,Milnor Jonah³,Pringle Charles⁴,Rivera Susan⁵

Affiliation:

1. Central Washington University,Information Technology and Administrative Management Department

2. Central Washington University,Finance, Accounting, and Economics Departments

3. Central Washington University,Engineering Technologies, Safety, and Construction Department

4. Central Washington University,Professor, MET Program Coordinator Engineering Technologies, Safety, and Construction Department

5. Central Washington University,Professor Information Technology and Administrative Management Department

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10553376/10553404/10553583.pdf?arnumber=10553583

Reference22 articles.

1. ANSI/IEC 60529-2020 Degrees of Protection;Degrees of Protection Provided by Enclosures (IP Code) (Identical National Adoption),2020

2. Consumer responses to planned obsolescence

3. Fairphone IP Rating

4. The new Fairphone 5. Designed for you. Made fair

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