Author:
Jianzheng Hu ,Lianqiao Yang ,Moo Whan Shin
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials
Cited by
32 articles.
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1. Comparison of blue and white packaged LED degradation;Reliability and Failure Analysis of High-Power LED Packaging;2023
2. Effect of environment on white packaged LED reliability;Reliability and Failure Analysis of High-Power LED Packaging;2023
3. Study of Light Degradation in High Power LEDs as a Function of the Feeding Waveform;2020 IEEE International Autumn Meeting on Power, Electronics and Computing (ROPEC);2020-11-04
4. Predicting of luminous flux for a LED array using artificial neural network;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07
5. Structural response of an injection molding part of the fuser mechanism in laser printer under thermo-mechanical coupling;Advances in Mechanical Engineering;2019-04