In Situ Monitoring of Creep Deformation in Single Crystal SAC305 Solder Joint at Different Temperatures-Reference-Cited by-同舟云学术

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In Situ Monitoring of Creep Deformation in Single Crystal SAC305 Solder Joint at Different Temperatures

Published:2023-05-30 Issue: Volume: Page:
ISSN:
Container-title:2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Bharamgonda Aniket¹,Deshpande Abhishek¹,Dasgupta Abhijit¹

Affiliation:

1. University Of Maryland,CALCE,College Park,USA

Funder

University of Maryland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177604.pdf?arnumber=10177604

Reference6 articles.

1. Virtual Testing and Digital Twin Approaches for Response of Grain-scale Solder Interconnects to Multiaxial Loading

2. Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints

3. Multi-scale Crystal Viscoplasticity Approach for Estimating Anisotropic Steady-State Creep Properties of Single-Crystal SnAgCu Alloys

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling the Microstructure of Polycrystalline Sn–Ag–Cu Solders;Advanced Structured Materials;2024

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