A Study of Bonding Materials for GHz Ultrasonic Wavefront Computing
Author:
Affiliation:
1. Institute of Microeletronics, Agency for Science, Technology and Research (A*STAR),Singapore
2. School of Electrical and Computer Engineering, Cornell University,SonicMEMS Laboratory,Ithaca,NY,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9957114/9957143/09958758.pdf?arnumber=9958758
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1. High Quality Pt–Pt Metal Bonding for High Temperature Packaging
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2. Ultrasonic Wavefront Computing Architecture on CMOS for Fourier Transform Computation;2023 8th International Conference on Frontiers of Signal Processing (ICFSP);2023-10-23
3. Recent Advances and Challenges of 2D Fourier Transform Computational Accelerator Using GHz Ultrasonics;2023 IEEE 23rd International Conference on Nanotechnology (NANO);2023-07-02
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