Millisecond-Level Transient Temperature Monitoring Using an Ultra-Fast Response Thermocouple for Ultrasound-Induced Thermal Strain Imaging-Reference-Cited by-同舟云学术

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Millisecond-Level Transient Temperature Monitoring Using an Ultra-Fast Response Thermocouple for Ultrasound-Induced Thermal Strain Imaging

Published:2022-10-10 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Ultrasonics Symposium (IUS)
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Author:

Chen Mengyue¹,Zhang Bohua¹,Kim Howuk¹,Sheng Zhiyu²,Chen Qiyang³,Kim Kang²,Geng Xuecang⁴,Jiang Xiaoning¹

Affiliation:

1. North Carolina State University,Department of Mechanical and Aerospace Engineering,Raleigh,USA

2. University of Pittsburgh,Department of Medicine,Pittsburgh,USA

3. University of Pittsburgh,Department of Bioengineering,Pittsburgh,USA

4. Blatek Inc.,Boalsburg,USA

Funder

National Institutes of Health

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9957114/9957143/09958761.pdf?arnumber=9958761

Reference9 articles.

1. Multi-Focus Beamforming for Thermal Strain Imaging Using a Single Ultrasound Linear Array Transducer

2. Motion artifact reduction in ultrasound based thermal strain imaging of atherosclerotic plaques using time-series analysis

3. Magnetic resonance thermometry: Methodology, pitfalls and practical solutions

4. Design and Simulation of Heating Transducer Arrays for Ultrasound-Induced Thermal Strain Imaging

5. A fast response thermocouple for internal combustion engine surface temperature measurements

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