Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range

Author:

Rajo-Iglesias Eva,Kildal Per-Simon,Zaman Ashraf Uz,Kishk Ahmed

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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