Drop-on-Demand Laser Sintering With Silver Nanoparticles for Electronics Packaging-Reference-Cited by-同舟云学术

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Drop-on-Demand Laser Sintering With Silver Nanoparticles for Electronics Packaging

Published:2012-05 Issue:5 Volume:2 Page:868-877
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Maekawa Katsuhiro,Yamasaki Kazuhiko,Niizeki Tomotake,Mita Mamoru,Matsuba Yorishige,Terada Nobuto,Saito Hiroshi

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6194283/06161680.pdf?arnumber=6161680

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