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Optimization of a Pin Surface as a Solution to Suppress Cavity Modes in a Packaged W-Band Microstrip Receiver

  • Published:2014-06 Issue:6 Volume:4 Page:975-982
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Rebollo Ainara,Gonzalo Ramon,Ederra Inigo

Funder

Spanish Ministry of Science and Innovation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Submillimeter Wave Rectangular Waveguide and its Flange Design Based on Gap Waveguide Technology;2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2023-05-14

2. Compact Planar W-Band Front-End Module Based on EBG Packaging and LTCC Circuits;IEEE Transactions on Circuits and Systems II: Express Briefs;2021-03

3. A Gap Waveguide-Based Compact Rectangular Waveguide to a Packaged Microstrip Inline Transition;Applied Sciences;2020-07-20

4. Suppression of Cavity Resonant Coupling by L-Shaped Metal Plate on Microwave Module Lid;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-07

5. A Chebyshev Transformer-Based Microstri-to-Groove-Gap-Waveguide Inline Transition for MMIC Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-08
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