Funder
Defense Advanced Research Projects Agency (DARPA) ICECool Fundamentals (FUN) and Applications (APPS) programs with Dr. Avram Bar-Cohen as the Program Director
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Case-embedded cooling for high heat flux microwave multi-chip array;Applied Thermal Engineering;2022-09
2. A Novel Micro-channel Package Based on Stress Cushioning of Ceramic Interlayer;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. Heat Pipe Thermal Performance in Heat Pipe Heatsink;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31