Author:
Yoonjin Won ,Jungwan Cho ,Agonafer Damena,Asheghi Mehdi,Goodson Kenneth E.
Funder
Air Force Office of Scientific Research (AFOSR) and Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office through the Near Junction Thermal Transport and Intrachip/Interchip Enhanced Cooling Programs
DARPA through the Project entitled Phase Separation Diamond Microfluidics for HEMT Cooling monitored by Avi Bar Cohen
Direct Sponsorship through Raytheon, BAE Systems, and RFMD
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
103 articles.
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