Multilayer Packaged Single- and Dual-Band Dual-Channel Bandpass Filters Based on Substrate Integrated Waveguide Cavities-Reference-Cited by-同舟云学术

Multilayer Packaged Single- and Dual-Band Dual-Channel Bandpass Filters Based on Substrate Integrated Waveguide Cavities

Published:2023 Issue: Volume: Page:1-1
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zhang Gang¹^ORCID,Zhou Xin²^ORCID,Hu Jianhui¹,Tam Kam-Weng²^ORCID,Li Desen²,Zhang Zhuowei²^ORCID,Ma Tianye³,Yang Jiquan¹^ORCID

Affiliation:

1. School of Electrical and Automation Engineering, Jiangsu Key Laboratory of3D Printing Equipment and Manufacturing, Nanjing Normal University, Nanjing, China

2. Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macao SAR, China

3. Key Laboratory of Antenna and Microwave Technology, Nanjing Research Institute of Electronics Technology, Nanjing, China

Funder

Qing Lan Project of Jiangsu Province of China

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/5673025/10309216.pdf?arnumber=10309216

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