Author:
Zhou Hai ,Jiawei Zhang ,Chaobo Shen ,Evans John L.,Bozack Michael J.,Basit Munshi M.,Suhling Jeffrey C.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
21 articles.
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1. Evaluation of Directional Properties of SAC305 Solder Joints Using the Nanoindentation Technique;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
2. Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
4. Investigation and Comparison of Aging Effects in SAC+Bi Solders Exposed to High Temperatures;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
5. Reliability analysis for TO-247 multilayered power module packaging under mechanical oscillation based on finite element method;Microelectronics Reliability;2021-03