Funder
VD Division and the DMC R&D Center of Samsung Electronics
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
5 articles.
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1. Modeling and Analysis of Simultaneous Switching Noise for Full Wafer Scale Chip Core;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
2. Exploratory methodology for power delivery;Graphs in VLSI;2022-06-30
3. Simplified Chip Power Modeling Methodology with Current Profile Slope Information for Display Timing Controllers;JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE;2020-10-31
4. Power Delivery Exploration Methodology Based on Constrained Optimization;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2020-09
5. Versatile Framework for Power Delivery Exploration;2018 IEEE International Symposium on Circuits and Systems (ISCAS);2018