Thermal Design and Characterization of Heterogeneously Integrated InGaP/GaAs HBTs-Reference-Cited by-同舟云学术

Thermal Design and Characterization of Heterogeneously Integrated InGaP/GaAs HBTs

Published:2016-05 Issue:5 Volume:6 Page:740-748
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Choi Sukwon,Peake Gregory M.,Keeler Gordon A.,Geib Kent M.,Briggs Ronald D.,Beechem Thomas E.,Shaffer Ryan A.,Clevenger Jascinda,Patrizi Gary A.,Klem John F.,Tauke-Pedretti Anna,Nordquist Christopher D.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/7470653/07457639.pdf?arnumber=7457639

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