Fan-Out Panel-Level Packaging of Mini-LED RGB Display-Reference-Cited by-同舟云学术

Fan-Out Panel-Level Packaging of Mini-LED RGB Display

Published:2021-05 Issue:5 Volume:11 Page:739-747
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lau John H.^ORCID,Ko Cheng-Ta,Lin Curry,Tseng Tzvy-Jang,Yang Kai-Ming^ORCID,Xia Tim,Lin Puru Bruce,Peng Chia-Yu,Lin Eagle^ORCID,Chang Leo,Liu Ning,Chiu Show May,Lee Tzu Nien

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9432432/09393937.pdf?arnumber=9393937

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