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A New High-Speed Memory Interconnect Architecture Using Microwave Interconnects and Multicarrier Signaling

  • Published:2014-02 Issue:2 Volume:4 Page:332-340
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Bensalem Brahim,Aberle James T.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparison of Wideband Interconnecting Technologies for Multigigahertz Novel Memory Architecture;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-04

2. Proposal and simulation of a DC–110 GHz waveguide using metal shielding and three-dimensional extension structure;Japanese Journal of Applied Physics;2018-11-19

3. Theoretical and Experimental Investigation of HMSIW-Based High-Speed Data Transmission System Using QPSK Scheme;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-11

4. High-Speed Interconnect System Using QPSK Scheme Based on Substrate Integrated Waveguide;Journal of Circuits, Systems and Computers;2017-08-23

5. An Effective Approach to Deembed the Complex Propagation Constant of Half-Mode SIW and Its Application;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-01
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