Author:
Zhang Heng Yun,Zhang Xiao Wu,Lau B. L.,Lim Sharon,Ding Liang,Yu M. B.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
12 articles.
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1. Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Thermal Characterization of 2.5D FCBGA for GPU Application;2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC);2020-12-02
3. Effectiveness of thermal redistribution layer in cooling of
3D ICs;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2020-11-24
4. Single-Phase Microfluidic Cooling of 2.5D-SICs for Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-09
5. Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging;Journal of Electronic Packaging;2020-06-29