Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations-Reference-Cited by-同舟云学术

Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations

Published:2014-08 Issue:8 Volume:4 Page:1284-1292
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Souare Papa Momar,Fiori Vincent,Farcy Alexis,de Crecy Francois,Jamaa Haykel Ben,Borbely Andras,Coudrain Perceval,Colonna Jean-Philippe,Gallois-Garreignot Sebastien,Giraud Bastien,Cheramy Severine,Tavernier Clement,Michailos Jean

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/6869070/06839023.pdf?arnumber=6839023

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