Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology-Reference-Cited by-同舟云学术

Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology

Published:2022-10 Issue:10 Volume:12 Page:1681-1691
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zhou Xin¹^ORCID,Zhang Gang¹^ORCID,Feng Shuai¹^ORCID,Tam Kam Weng²^ORCID,Zhang Zhuowei²,Tang Wanchun¹^ORCID,Yang Jiquan¹^ORCID

Affiliation:

1. School of Electrical and Automation Engineering and the Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing, Nanjing Normal University, Nanjing, China

2. Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macau, China

Funder

National Natural Science Foundation of China

Qing Lan Project of Jiangsu Province of China and Postgraduate Research and Practice Innovation Program of Jiangsu Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9953743/09924238.pdf?arnumber=9924238

Reference19 articles.

1. A cascaded six order bandpass siw filter using electric and magnetic couplings technology

2. Multilayer Substrate Integrated Waveguide (SIW) Filters With Higher-Order Mode Suppression

3. Half-mode versus folded SIW filters: Modeling and design

4. In-Line Ports Dual-Mode Substrate Integrated Waveguide Filter With Flexible Responses

5. Resonance Characteristics of Substrate-Integrated Rectangular Cavity and Their Applications to Dual-Band and Wide-Stopband Bandpass Filters Design

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