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A Novel Dual-Sided Fly-By Topology for 1–8 DDR With Optimized Signal Integrity by EBG Design

  • Published:2018-10 Issue:10 Volume:8 Page:1823-1829
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Chiu Chih-ChiaORCID,Yang Kang-YunORCID,Lin Ying-Hsi,Wang Wen-Shan,Wu Ting-Ying,Wu Ruey-Beei

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mathematical optimization and machine learning to support PCB topology identification;Advances in Radio Science;2023-12-01

2. Package Propagation Delay Dependency of Advanced Fly-By Routing For Next Generation DDR5;2023 IEEE 27th Workshop on Signal and Power Integrity (SPI);2023-05-07

3. Artificial Neural Networks for Microwave Computer-Aided Design: The State of the Art;IEEE Transactions on Microwave Theory and Techniques;2022-11

4. Advanced Fly-By Routing Topology for Gbps DDR5 Systems;2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2022-10-09

5. Symmetric-Cell EBG Theory and Its Applications to Vias Daisy Chain for Residual Stub Detection;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
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