Author:
Codecasa L.,D'Amore D.,Maffezzoni P.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
50 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of a reduced-order AROMM model for the nonlinear thermal simulation of electronic components;International Journal of Heat and Mass Transfer;2024-11
2. Fast Error-Bounded MOR-Based Approximation of Heat Conduction Problems in Electronics;2024 IEEE 28th Workshop on Signal and Power Integrity (SPI);2024-05-12
3. Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
4. Structure Curve Representation of Dynamic Thermal Multi-Ports;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
5. Determining the Contribution of Spatial Sub-Regions to Structure Functions;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28