3D Thermal Resistance Model for Real-Time Temperature Monitoring of Multi-Chip IGBT Modules
Author:
Affiliation:
1. College of Electrical Engineering, Zhejiang University,Hangzhou,China
Funder
National Key Research and Development Program of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10394673/10394683/10394773.pdf?arnumber=10394773
Reference23 articles.
1. Power Electronic Transformer-Based Railway Traction Systems: Challenges and Opportunities
2. Thermal Loading and Lifetime Estimation for Power Device Considering Mission Profiles in Wind Power Converter
3. A Thermal Modeling Method Considering Ambient Temperature Dynamics
4. A Physics-Based Improved Cauer-Type Thermal Equivalent Circuit for IGBT Modules
5. Temperature Evolution as an effect of Wire-bond Failures in a Multi-Chip IGBT Power Module
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